Daily Semiconductor Industry Information By Lansheng Technology

1. The internationally renowned semiconductor company Infineon Technology Co., Ltd. issued a communiqué on the 3rd that it has signed a long-term supply agreement with Beijing Tianke Heda #Semiconductor Co., Ltd., a Chinese silicon carbide material supplier, to ensure more competitive products. Powerful silicon carbide source to maintain the stability of the overall supply chain.

2. #TSMC is planning to establish a joint venture with NXP Semiconductors, Bosch, #Infineon, etc., and will spend up to 10 billion euros to set up a wafer production plant in Saxony, Germany. According to some sources, TSMC will pass the project of setting up a factory in Germany as soon as August, and the German factory mainly produces 28nm chips.

3. #NXP Semiconductors' earnings per share in the first quarter were US$3.19, and the market was expected to be US$3.02; revenue was US$3.12 billion, which was lower than the US$3.14 billion in the same period last year, and the market was expected to be US$3 billion. The company expects earnings per share of $3.07 to $3.49 in the second quarter, compared with a market forecast of $2.99; revenue of $3.1 billion to $3.3 billion, compared with a market forecast of $3.04 billion.

4. Recently, Samsung posted on social media that the yield rate of its 4nm chip process has improved and is close to the level of 5nm, and that the next-generation 4nm process will provide a higher yield rate.

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