Infineon's HYPERRAM 3.0 memory chip is paired with the third-generation chipset of Autotalks to enable automotive V2X applications

【June 30, 2023, Lansheng Technology Information】Infineon Technologies AG and Autotalks announced that they will cooperate to provide solutions for the new generation of V2X applications. Infineon will provide automotive grade HYPERRAM™ 3.0 memory chips in this cooperation to support Autotalks' TEKTON3 and SECTON3 V2X reference designs.

TEKTON3 is a fully integrated V2X SoC chip specially designed to support driving operations based on Internet of Vehicles. V2X enables mutual communication between vehicles and between vehicles and the surrounding environment, and ultimately improves the safety of road traffic. Concurrent dual-band radio technology and full V2X software technology implementation typically require external memory to manage modem and application requirements. HYPERRAM meets the cost, power density and performance requirements of external memory and is the premier memory chip.

The HYPERRAM 3.0 device provided by Infineon has a 16-bit HYPERBUS interface and can achieve a transmission rate of 800 MBps, further improving the throughput of Infineon's HYPERRAM series products. HYPERRAM 3.0 devices meet automotive-grade standards and can meet the data processing needs of TEKTON3, making them ideal expansion storage solutions.

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