Infineon and Semikron Danfoss sign supply agreement for electric vehicle chips

【Lansheng Technology Information】Recently, Infineon and Semikron Danfoss signed a multi-year batch supply agreement for silicon-based electric vehicle chips. Infineon will supply Semikron Danfoss with chipsets consisting of IGBTs and diodes. These chips are mainly used in the power modules of inverters, which are used in the main drive of electric vehicles.

According to the agreement, Semikron Danfoss' IGBTs and diodes will be produced by Infineon's factories in Dresden, Germany and Kulim, Malaysia.

In the choice of partners, Semikron Danfoss is also more inclined to diversification. The main reason is that in recent years, due to the impact of the shortage of semiconductor production capacity and the security of the semiconductor supply chain caused by political factors, the supply chain of semiconductors has become more and more fragile. In order to stably supply different customers, supply chain diversification is the only way.

In addition to signing a long-term supply contract with Infineon, Semikron Danfoss has also established a long-term cooperative relationship with Japan’s ROHM. For many years, ROHM has been a partner of SEMIKRON-Danfoss in the supply of silicon carbide devices. In April this year, SEMIKRON-Danfoss also launched a power module equipped with ROHM 1200V IGBT.

In the field of SiC, in March last year, before the merger of the two companies, SEMIKRON signed an automotive-grade silicon carbide power module contract of more than one billion euros with a leading German automaker, agreeing to fully adopt the latest eMPack series automotive-grade silicon carbide power modules on the next-generation electric vehicle controller platform of the car customer in 2025.

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