Intel Selected for COOLERCHIPS Program, Committed to Creating New Cooling Technologies for Future Data Centers

【Lansheng Technology Information】Recently, the U.S. Department of Energy (DOE) announced that 15 institutions, including Intel, were selected to create high-performance, high-efficiency and energy-saving cooling solutions for future data centers. The news was announced in May as part of the COOLERCHIPS program. The COOLERCHIPS program, supported by the U.S. Department of Energy's Advanced Research Projects Agency for Energy (ARPA-E), aims to optimize the cooling operations of information processing systems to improve energy efficiency, reliability, and carbon ultra-efficiency. Among them, Intel's project will receive a three-year grant totaling US$1.71 million. The project will push Intel to deploy more cores and transistors in its high-performance processors while managing the heat generated by future devices, thereby continuing Moore's Law.

Simple, sustainable and easy to upgrade features are the reasons why immersion cooling technology is adopted by users. The project will enable the development of two-phase immersion cooling technology capable of handling the exponential growth in power required by processors over the next decade.

Intel will collaborate with academic and industry leaders to develop innovative immersion cooling solutions. Intel will lead and oversee the conduct of the study, provide thermal testing tools for the evaluation, and define form factors and constraints for next-generation processors, including hotspot locations.

Intel's project created a coral-shaped submerged liquid-cooled heatsink with ultra-low thermal resistance, integrated into a three-dimensional vacuum evaporation chamber to support denser, higher-performance devices. Intel's design will dissipate heat more efficiently by optimizing the three-dimensional vacuum evaporation chamber to address the challenges of two-phase immersion liquid cooling.

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