Intel announces its PowerVia technology for backside power delivery

【Lansheng Technology information】According to news from Intel on June 6, it implemented backside power supply technology on product-level test chips to meet the performance requirements of the next computing era.

According to reports, as Intel's backside power delivery solution, PowerVia will be launched on Intel's 20A process node in the first half of 2024. By moving power lines to the backside of the wafer, PowerVia solves the growing interconnect bottleneck in die scaling.

Ben Sell said, "Intel is actively advancing the 'four-year five-process node' plan, and is committed to integrating one trillion transistors in a single package by 2030. PowerVia is very important to these two goals. Both are important milestones. By adopting experimental production process nodes and their test chips, Intel reduces the risk of using backside power for advanced process nodes and brings backside power technology to the market."

It is reported that Intel separates the research and development of PowerVia technology and transistors to ensure that PowerVia can be properly used in the production of Intel 20A and Intel 18A process chips. Before integrating with the RibbonFET transistors that will also be introduced with Intel's 20A process node, PowerVia is tested on its internal test node to continuously debug and ensure that it functions well. Intel said that after adopting and testing PowerVia on the test chip, it has been confirmed that this technology can indeed significantly improve the efficiency of the chip, with a cell utilization rate of more than 90%, and help to achieve a large scale of transistors, so that chip design companies can Improve product performance and energy efficiency.

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