Intel plans to invest $4.6 billion in a semiconductor assembly and testing plant in Poland

On June 19, Lansheng Technology News, Intel has announced that it plans to invest up to 4.6 billion US dollars to build a semiconductor assembly and testing plant in Poland, which will help meet Intel's key demand for assembly and testing capabilities expected by 2027.

While Intel said it would invest as much as $4.6 billion in the plant, it's unclear how much of that could be covered by local government subsidies or funds provided under the newly passed European Chip Act.

Intel chose Poland as the location for the new factory for several reasons, including its infrastructure, strong talent base and favorable business environment. The new fab is well positioned to work with Intel's planned wafer fabrication facility in Germany and its existing wafer fabrication facility in Ireland.

According to media reports, Intel CEO Pat Gelsinger is spending more than $80 billion to expand and modernize Intel's factory network to accommodate a new generation of manufacturing technology.

It is reported that Intel has promised to invest 25 billion US dollars to build a new factory in Israel. The factory in Kiryat Gat will open in 2027 and operate until at least 2035, employing thousands of people.

Last year, Intel announced plans to build a large chip factory in Germany, Ireland and France. Last Thursday, it was reported that the German government and Intel were close to reaching a subsidy agreement of 9.9 billion euros, higher than the previous 6.8 billion euros. There are also reports that the company will announce a German factory deal on Monday.

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