Microchip Introduces Silicon Carbon Electronic Fuse Handout Board

【Lansheng Technology Information】The high-voltage electrical subsystems of battery electric vehicles (BEV) and hybrid electric vehicles (HEV) need to have a protection mechanism to protect the high-voltage power distribution and loads in overload conditions. In order to provide BEV and HEV designers with faster and more reliable high-voltage circuit protection solutions, Microchip Technology Inc. announced on May 12 the release of a silicon carbide (SiC) electronic fuse (E-Fuse) demonstration board. The device is available in 6 models for 400-800V battery systems rated up to 30 amps.

The E-Fuse demo board detects and interrupts fault currents at the microsecond level, which is 100 to 500 times faster than traditional mechanical methods thanks to a high-voltage solid-state design. The fast response time greatly reduces the peak short-circuit current from tens of kiloamperes to hundreds of amps, preventing fault events from causing hard failures.

“This E-Fuse demo board provides BEV/HEV OEM designers with a SiC technology-based solution to quickly and reliably protect electronics to jump-start the development process,” said Clayton Pillion, vice president of Microchip’s Silicon Carbide Business Unit. “The E-Fuse’s solid-state design also alleviates concerns about the long-term reliability of electromechanical devices without degradation from mechanical shock, arcing or contact bounce.”

With the resettable feature of the E-fuse demo board, designers can easily package the device in a vehicle without worrying about the repairability limitations of the design. This reduces design complexity and enables flexible vehicle packaging, enabling improved powertrain distribution for BEV/HEV.

Because the E-fuse demo board has a built-in local interconnect network (LIN) communication interface, OEMs can accelerate the development of auxiliary SiC-based applications. The LIN interface can be configured with an overcurrent trip feature that requires no modification of hardware components and can also report diagnostic status.

The E-fuse demo board features Microchip's SiC MOSFET technology and PIC® microcontrollers' Core Independent Peripheral (CIP) and LIN-based interface for unrivaled ruggedness and performance. These kits are automotive qualified and offer lower component count and higher reliability than discrete designs.

Microchip's SiC power solutions offer the industry's broadest and most flexible portfolio of MOSFETs, diodes and gate drivers, including die, discrete, modules and customizable power blocks.

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