NXP introduces new top-cooled packaging technology for RF power devices to further reduce the size of 5G wireless products

NXP Semiconductors has announced a family of top-cooled RF amplifier modules featuring innovative packaging technologies that help create thinner and lighter wireless products for 5G infrastructure. Smaller base stations can improve the ease and economy of installation while allowing for a more decentralized integration into the environment. NXP’s family of GaN multi-chip modules combined with a new RF power device top cooling solution not only helps reduce the thickness and weight of radio products by more than 20%, but also reduces the carbon footprint of 5G base station manufacturing and deployment.

Pierre Piel said: "Top cooling technology presents a major opportunity for the wireless infrastructure industry. With this technology, we can combine high power capabilities with excellent thermal performance to create smaller RF subsystems. Based on this Innovative technological solutions allow us to deploy greener base stations while maintaining the network density required to realize the full performance benefits of 5G."

NXP's new top-cooled devices offer significant design and manufacturing advantages, such as eliminating the need for dedicated RF shielding, enabling the use of cost-effective and thinner printed circuit boards, and separating thermal management and RF design. These features help network solution providers create thinner and lighter 5G wireless products for mobile network operators, while shortening the overall product design cycle.

NXP's first family of top-cooled RF power modules is designed for 32T32R, 200W RF, covering the 3.3GHz to 3.8GHz frequency range. Combining NXP's proprietary LDMOS and GaN semiconductor technologies, the device combines high gain, high efficiency and wideband performance, delivering 31 dB gain and 46% efficiency at 400MHz instantaneous bandwidth.

Lansheng Technology Limited, which is a spot stock distributor of many well-known brands, we have price advantage of the first-hand spot channel, our main brands are STMicroelectronics, Toshiba, Microchip, Vishay, Marvell, ON Semiconductor, ect.

To learn more about our products, services, and capabilities, please visit our website at http://www.lanshengic.com