Renesas signs 10-year wafer supply agreement with Wolfspeed

【Lansheng Technology Information】: On July 5th, Renesas Electronics and Wolfspeed, Inc, a global leader in silicon carbide technology, announced the execution of a wafer supply agreement. Renesas paid a deposit of US$2 billion to ensure a 10-year SiC bare and epi wafer supply commitments.

The high-quality silicon carbide wafers provided by Wolfspeed will pave the way for Renesas to expand the production of silicon carbide power semiconductors starting in 2025.

The ten-year supply agreement, which calls for Wolfspeed to supply Renesas with 150mm silicon carbide bare and epitaxial wafers in 2025, reinforces both companies' vision for a transition from silicon to silicon carbide semiconductor power devices.

The agreement also envisages the supply of 200mm silicon carbide bare and epitaxial wafers to Renesas following the full operation of the recently announced John Palmour silicon carbide fabrication center.

Demand for more efficient power semiconductors is increasing dramatically due to the growth of electric vehicles and renewable energy. Renesas is rapidly responding to the growing demand for power semiconductors by expanding its in-house manufacturing capabilities.

Silicon carbide devices enable higher energy efficiency, greater power density and lower system cost compared to traditional silicon power semiconductors.

In an increasingly energy-conscious world, the adoption of SiC is growing in multiple high-volume applications spanning electric vehicles, renewable energy and energy storage, charging infrastructure, industrial power supplies, traction and variable speed drives universal.

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