Toshiba Launches Automotive 40V N-Channel Power MOSFET in New Package Contributing to High Heat Dissipation of Automotive Equipment

【Lansheng Technology Information】Toshiba announced today that it has launched two automotive 40V N-channel power MOSFETs using Toshiba's new S-TOGLTM package and U-MOS IX-H process chip - "XPJR6604PB" and "XPJ1R004PB".

High safety-level applications such as autonomous driving systems can ensure reliability through redundant designs, so they integrate more components and require more surface-mount space than standard systems. Therefore, to further reduce the size of automotive equipment, power MOSFETs that can be surface-mounted at high current densities are required.

The XPJR6604PB and XPJ1R004PB adopt Toshiba's new S-TOGLTM package (7.0mm×8.44mm[1]), which is characterized by a post-free structure that integrates the source connector and external pins. The multi-pin structure of the source pins reduces package resistance.

Compared with Toshiba TO-220SM (W) package products [2] with the same thermal resistance characteristics, the combination of S-TOGLTM package and Toshiba U-MOS IX-H process can achieve a significant reduction of 11% in on-resistance. The new package also reduces the required surface mount area by approximately 55 percent compared to the TO-220SM(W) package. In addition, products in the new package offer a drain current rating of 200A, which is higher than that of Toshiba's similarly sized DPAK+ package (6.5mm x 9.5mm[1]), enabling high current. Overall, the S-TOGL™ package enables high density and compact layout, reduces the size of automotive equipment, and contributes to high heat dissipation.

Since automotive equipment may operate in extreme temperature environments, the reliability of surface mount solder joints is a key consideration. The S-TOGLTM package adopts gull-wing pins, which can reduce surface mount stress and improve the reliability of solder joints.

Toshiba will continue to expand its lineup of power semiconductors and contribute to the realization of carbon neutrality through user-friendly, high-performance power devices.

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