Winbond Electronics Launches Next-Generation 8Mb Serial NOR Flash for Space-Constrained IoT Edge Devices

On June 15, 2023, Lansheng Technology News - Winbond Electronics, a global leader in semiconductor storage solutions, announced today the launch of the first product of Serial NOR Flash, 8Mb 3V W25Q80RV. The product has stronger read performance and smaller size, especially meeting the needs of edge devices in industrial and consumer application scenarios.

This 8Mb capacity Serial Flash is produced by Winbond Electronics' own 12-inch wafer fab, and is manufactured using the latest generation of 58nm process. Compared with the previous generation products using 90nm, the size is significantly reduced. The KGD and WLCSP versions of this product are ideal for a variety of small IoT devices.

Alan Niebel, president of Web-Feet Research, said: "By 2023, the Internet of Things will expand to 50 billion connected devices. Winbond's 3V 8Mb Serial NOR Flash is very suitable for the automotive and Internet of Things fields. Overall, the Internet of Things is expected to Continue to grow in the new interconnected world, and by 2027, global Serial Flash shipments will reach 12.9 billion."

Winbond Electronics has supported customers' needs for 8Mb Serial Flash with W25QxxDV series products for many years. The application fields include instrumentation, networking equipment, PC, printer, car and game equipment. Now, the introduction of W25QxxRV can support more emerging applications and use cases. For example, in advanced technologies, KGD and WLCSP solutions are used to achieve wireless connectivity and adopt smaller lead frame packages.

The 8Mb flash memory product launched by Winbond Electronics this time has a higher read speed, which can improve system performance, and also brings faster programming and erasing speeds for firmware OTA and industrial applications. In addition, the product's smaller form factor and system-in-package (SiP) bring greater value to a variety of embedded systems.

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